Description
Features / Benefits 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder. Lead free Complies with RoHS Exceeds the impurity requirements of J-Std-006 No Clean flux 21 Gauge, 0.032″ diameters Excellent wettability Hard non-conductive residues 1 lb of lead free solder has 27% more length than leaded solder
